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Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding

Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding

Beryllium Copper bonding wire

Ultrasonic bonding copper wire

0.01-0.4MM beryllium wire

Place of Origin:

CHINA

Nom de marque:

WINNER

Certification:

ISO9001

Model Number:

BC010

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Détails de produit
Application:
Wire bonding
Bond Strength:
High
Bonding Method:
Ultrasonic, Thermocompression, Laser
Surface Finish:
Smooth
Production Method:
Drawing
Package:
Spool, Reel, Coil
Purity:
99.99%
Length:
100 meters
Melting Point:
1064 degrees Celsius
Length Meters:
500/1000
Wire Diameter:
0.01-0.4MM
Mettre en évidence:

Beryllium Copper bonding wire

,

Ultrasonic bonding copper wire

,

0.01-0.4MM beryllium wire

Conditions de paiement et d'expédition
Minimum Order Quantity
1pc
Prix
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8working day
Payment Terms
D/A,T/T,Western Union
Supply Ability
1000000 rolls per month
Description de produit

Product Description

Our Beryllium Copper (BeCu) Wire offers the perfect combination of strength, durability, and conductivity, making it the ideal choice for upgrading and enhancing modern electronic devices. With its exceptional mechanical performance, thermal conductivity, and electrical stability, BeCu wire is widely used in demanding industries such as semiconductors, telecommunications, aerospace, and precision electronics.

Unlike conventional copper wire, Beryllium Copper Wire provides superior tensile strength, excellent fatigue resistance, and long service life, ensuring reliability even in harsh or high-load environments. Whether for connectors, relays, springs, sensors, or microelectronic components, our BeCu wire delivers stable performance and durability that you can trust.

Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding 0


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