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Maison > produits > Fil d'argent plaqué or >
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Bonding Wire

High Bond Strength Gold Plated Silver Wire

Smooth Surface Finish Spooled Wire

Lieu d'origine:

CHINE

Nom de marque:

WINNER

Certification:

ISO9100

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High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics
Détails de produit
Revêtement:
Or
Force de liaison:
Haut
les certifications:
ISO 9001
Résistance à la corrosion:
Haut
Élongation:
3-20%
Type de produit:
Fil de liaison
Finition de surface:
Lissé, mat, texturé
Diamètre:
0,7-1,0 mil
Matériel:
Or, argent
Pureté:
99,99%
Mettre en évidence:

High Conductivity Bonding Wire

,

High Bond Strength Gold Plated Silver Wire

,

Smooth Surface Finish Spooled Wire

Conditions de paiement et d'expédition
Quantité de commande min
1000m
Prix
999
Détails d'emballage
Rouleau, emballage neutre ou avec un logo OEM
Délai de livraison
5-8 jours
Conditions de paiement
T / T, D / A, Western Union
Capacité d'approvisionnement
9999999
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Description de produit
High Conductivity Gold Plated Silver Wire on Spool
Factory Supply Ultra Fine Gold Plated Silver Wire
Gold Plated Silver Spooled Wire combines the high conductivity of silver with the corrosion resistance of gold, making it ideal for scientific research and laboratory use. This specialized wire is engineered for demanding applications where signal integrity must be maintained under extreme conditions.
Key Applications
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection systems
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Precision engineering projects
  • Advanced sensor development
Product Advantages
  • Superior conductivity with low contact resistance
  • Excellent corrosion resistance from gold plating
  • Consistent signal transmission in extreme environments
  • Spooled format for precise handling in clean rooms
  • Ideal for research setups and laboratory applications
Product Images
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 0 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 1 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 2 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 3 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 4 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 5
Étiquettes：

Fil d'argent plaqué en or ultrafin

Fil d'argent plaqué or de haute pureté

fils d'argent plaqués or

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Téléphone：86-158-1857-6616
Email：sales@winner-sc.com
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SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Sichuan WINNER Special Electronic Materials Co., Ltd. se concentre sur le fil métallique revêtu ultra-fin pour l'emballage de semi-conducteurs.
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