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Maison > produits > Fil d'argent plaqué or >
0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components

0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components

0.05mm Gold Plated Silver Wire

ISO 9001 Certified Bonding Wire

99.99% Purity Spooled Wire

Lieu d'origine:

CHINE

Nom de marque:

WINNER

Certification:

ISO9100

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0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components
0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components
Détails de produit
Revêtement:
Or
Force de liaison:
Haut
les certifications:
ISO 9001
Résistance à la corrosion:
Haut
Élongation:
3-20%
Type de produit:
Fil de liaison
Finition de surface:
Lissé, mat, texturé
Diamètre:
0,7-1,0 mil
Matériel:
Or, argent
Pureté:
99,99%
Mettre en évidence:

0.05mm Gold Plated Silver Wire

,

ISO 9001 Certified Bonding Wire

,

99.99% Purity Spooled Wire

Conditions de paiement et d'expédition
Quantité de commande min
1000m
Prix
999
Détails d'emballage
Rouleau, emballage neutre ou avec un logo OEM
Délai de livraison
5-8 jours
Conditions de paiement
T / T, D / A, Western Union
Capacité d'approvisionnement
9999999
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Contact maintenant
Description de produit
Factory Directly Supply 0.05mm Gold Plated Silver Spooled Wire for Precision Electronic Components
Product Overview
Our Ultra Fine Gold Plated Silver Wire combines the superior conductivity of silver with the exceptional corrosion resistance of gold. This premium material is specifically engineered for demanding scientific research and laboratory applications where performance and reliability are critical.
Key Features
  • 0.05mm diameter for precision applications
  • Gold plating provides superior corrosion resistance
  • Silver core ensures excellent electrical conductivity
  • Spooled format for clean room handling and precise dispensing
  • Maintains signal integrity in extreme conditions
  • Low contact resistance for consistent transmission
Applications
This specialized wire is widely used in:
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection equipment
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Advanced sensor development
  • Precision engineering projects
Product Images
0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 0 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 1 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 2 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 3 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 4 0.05mm Gold Plated Silver Bonding Wire with 99.99% Purity and ISO 9001 Certification for Precision Electronic Components 5
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Fil d'argent plaqué en or ultrafin

Fil d'argent plaqué or de haute pureté

fils d'argent plaqués or

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Email：sales@winner-sc.com
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Sichuan WINNER Special Electronic Materials Co., Ltd. se concentre sur le fil métallique revêtu ultra-fin pour l'emballage de semi-conducteurs.
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