Name: Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Brand: SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
SKU: MW001
Price: 999 USD
Availability: InStock

Maison > produits > Fil de liaison >

Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging

Ultrasonic Bonding Gold Wire

Bright Surface Finish Gold Wire

Semiconductor Packaging Gold Wire

Lieu d'origine:

Chine

Nom de marque:

WINNER

Certification:

ISO9100

Numéro de modèle:

MW001

Contactez-nous

Demandez une citation

Détails de produit

Application:

Emballage semi-conducteur, microélectronique, dispositifs médicaux

Emballer:

Bobine

Résistance à la corrosion:

Haut

Matériel:

Longueurs de longueur:

500/1000

Type de produit:

Fil de liaison

Revêtement:

Méthode de liaison:

Ultrasonique

Plage de température:

-40 ° C à 200 ° C

Finition superficielle:

Brillant

Conductivité:

98%

Mettre en évidence:

Ultrasonic Bonding Gold Wire

Bright Surface Finish Gold Wire

Semiconductor Packaging Gold Wire

Conditions de paiement et d'expédition

Quantité de commande min

1 pièce

Prix

999

Détails d'emballage

Rouleau, emballage neutre ou avec un logo OEM

Délai de livraison

5-8 jours ouvrables

Conditions de paiement

LC, Western Union, T/T

Capacité d'approvisionnement

100000 rouleaux par mois

Produits connexes

Vidéo

Fine 9999% Au gold wire/thread on a spool

Obtenez le meilleur prix

Vidéo

20um Gold Bonding Wire for High Electrical Performance and Low Loop in Semiconductor Packaging

Obtenez le meilleur prix

Vidéo

Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging

Obtenez le meilleur prix

Vidéo

24K Gold Bonding Wire 1mm Diameter for Microelectronics with 4N 99.99% Purity

Obtenez le meilleur prix

Contactez-nous

Contact maintenant

Description de produit

0.025MM/0.018MM 99.99 AU Wire Gold Bonding Wire

Product Specifications

Material	Gold
Diameter	0.0125, 0.05, etc. mm
Form	Wire
Purity	≥99.99%

Made from ultra-high purity gold (2N-4N), the Gold Bonding Wire is a key component in semiconductor assembly, providing excellent electrical conductivity for reliable connections. It is highly durable and resistant to corrosion, making it ideal for use in harsh environments. The wire is available in ultra-fine diameters ranging from 13 μm to 70 μm and in lengths from 100 meters to 500 meters. The ability to customize these specifications ensures flexibility for a wide range of applications, from advanced integrated circuits to microelectronic devices. Known for its exceptional mechanical properties and thermal conductivity, this bonding wire ensures stable, efficient, and long-lasting connections in high-performance devices.

Gold Wire Applications

Electronics and Semiconductors: Gold wire is extensively used in the electronics industry for bonding in semiconductor devices.
Electrical Contacts and Connectors: Due to its high conductivity and resistance to corrosion, gold wire is used in the manufacturing of electrical contacts and connectors.
Medical Devices: In medical devices, gold wire is used for its biocompatibility and conductive properties. It can be found in pacemakers, diagnostic equipment, and other implantable devices where reliable performance is crucial.